Underfill Adhesive
Technical characteristics:
One component, halogen free;
Rapid flow at room temperature;
Fast curing ,high reliability;
Good compatibility with solder paste;
Reworkable.
Application fields:
Mobile phone；
Automobile module;
Fingerprint recognition module;
Entertainment device, etc.
One component, halogen free;
Rapid flow at room temperature;
Fast curing ,high reliability;
Good compatibility with solder paste;
Reworkable.
Application fields:
Mobile phone；
Automobile module;
Fingerprint recognition module;
Entertainment device, etc.
PRODUCT Info
| Product Model | Colou | viscosity（cps） | Cure Condition | Period of use by room temperature | shelf life |
| EA5366 | Black | 350-450 | 6-8 min@130℃ | 3 days | 6 Months@-25℃ |
| EA5616 | Black | 350-500 | 6-8 min@130℃ | 3days | 6 Months@-25℃ |
| EA5325 | Black | 740-800 | 5-8 min@120℃ | 3days | 6 Months@-20℃ |